Category Archives: Agenda

Tuesday, December 13, 2016

7:30am-6:30pm Registration Open 8:00am-8:45am Breakfast 12:00pm-7:00pm Exhibits Open (when not in session) 10:30 – 10:45 a.m. Break 9:00am-12:00pm PRE-CONFERENCE TUTORIAL – Option 1:  Advances in Fan-Out Wafer Level Packaging Abstract: Now that Fan-out wafer level packaging (FO-WLP) has matured, unique advanced FO-WLP structures have been developed. This course will cover these advanced structures of FO-WLP…
Read more

Wednesday, December 14, 2016

7:00am-7:00pm Registration Open 7:00am-8:00am Breakfast Sponsored by: 10:00am-7:00pm Exhibits Open (when not in session) 8:00am-8:15am Opening Remarks – Conference Co-Chairs:Alan Huffman, Micross Advanced Interconnect Technology; Prof. Mitsu Koyanagi, Tohoku University; Mark Scannell, CEA-Leti SESSION 4 PLENARY SESSION – KEYNOTE 8:15am-9:00am Future Landscapes for 3D Integration: From Interposers to 3D High Density Jean  Michailos, STMicroelectronics SESSION…
Read more

Thursday, December 15, 2016

7:00am-12:00pm Registration Open 7:00am-8:00am Breakfast 8:00am-8:15am Opening Remarks – Conference Co-Chairs:  Alan Huffman, Micross Advanced Interconnect Technology; Prof. Mitsu Koyanagi, Tohoku University; Mark Scannell, CEA-Leti SESSION 10 FAN OUT AND OTHER COMPETITIVE TECHNOLOGIES Session Chair: Beth Keser, Qualcomm 8:15am-8:35am Path to the Fan-out SoC Tim Olson, DECA Technologies (Craig Bishop) 8:35am-8:55am Fan-out – An Optimal…
Read more