Category Archives: Agenda

Tuesday, December 5, 2017

7:30am-7:00pm Registration Open 8:00am-8:45am Breakfast 12:00pm-7:00pm Exhibits Open (when not in session) 10:30 – 10:45 a.m. Break 9:00am-12:00pm   (Select 1 of the 3 Tutorials only ** Tutorials an additional fee to conference registration during checkout) Pre-Conference Tutorials Run 9am-12pm the first morning. You may select one of the Tutorials only: Evolution of High Density…
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Wednesday, December 6, 2017

7:00am-7:00pm Registration Open 7:00am-8:00am Breakfast Sponsored by: 10:00am-7:00pm Exhibits Open (when not in session) 8:00am-8:15am Opening Remarks – Conference Co-Chairs: Phil Garrou, Microelectronic Consultants of NC; Prof. Mitsu Koyanagi, Tohoku University; Mark Scannell, CEA-Leti SESSION 4 PLENARY SESSION – KEYNOTE 8:15am-9:00am High Density Interconnects: Migrating from Concept to Mainstream Brandon Prior, Prismark SESSION 5 2.5/3D…
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Thursday, December 7, 2017

7:00am-12:00pm Registration Open 7:00am-8:00am Breakfast 8:00am-8:15am Opening Remarks – Conference Co-Chairs:  Phil Garrou, Microelectronic Consultants of NC; Prof. Mitsu Koyanagi, Tohoku University; Mark Scannell, CEA-Leti SESSION 10 PLENARY SESSION – KEYNOTE 8:15am-9:00am InFO Doug Yu, TSMC SESSION 11 FAN OUT WAFER LEVEL PACKAGING (FOWLP) Session Chair: John Hunt, ASE US 9:00am-9:20am Enabling the Fan Out…
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