Category Archives: Community

Program & Registration Now Open!

Register today to attend the 2017 3D ASIP conference to hear industry leaders discussing topics ranging from the status of 2.5/3D and other high density technologies to the transformation of substrate technology in the era of IoT. The full program Now Available! Program highlights include: Three in-depth tutorials on Tuesday, December 5 Speakers from around the world…
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Registration is Open!

3D ASIP 2017 Registration is Now Open! Register today to attend the 14th 3D ASIP conference, December 5-7, 2017 at the Marriott San Francisco Airport Hotel, San Francisco, California. Conference Organizers Conference Chair: Phil Garrou, Microelectronics Consultants of NC Technical Co-chairs: Mitsumasa Koyanagi, Tohoku University; Mark Scannell, CEA-Leti  
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