Category Archives: Community

TSV Stacked Memory has Finally Arrived!

Register today to attend the 2016 3D ASIP conference to hear industry leaders discussing topics ranging from the status of 2.5/3D and other high density technologies to the transformation of substrate technology in the era of IoT. The full program will available in Early September! Program highlights include: Two in-depth tutorials on Tuesday, December 13 Speakers from…
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Registration is Open!

3D ASIP 2016 Registration is Now Open! Register today to attend the 13th 3D ASIP conference, December 13-15, 2016 at the Marriott San Francisco Airport Hotel, San Francisco, California. Conference Organizers Technical Chair: Alan Huffman, RTI Program Coordinator & Past Chair: Phil Garrou, Microelectronics Consultants of NC Technical Co-chairs: Mitsumasa Koyanagi, Tohoku University; Mark Scannell, LETI…
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