Category Archives: Speakers – Tutorial

2017 Tutorial Speakers

Tutorial – Option 1: The Evolution of High Density Packaging Tuesday, December 5| *NEW TIME* 9:00am-11:00am 1. Microelectronic Packaging Platforms -Function & Early History of Packaging ​-Peripheral Leaded packages ​-Area array Packaging ​-BGA packaging ​-Bumping/ FC -Redistribution, UBM, Underfill ​-Wafer level Packaging (WLP) ​-Copper pillar bump ​-Embedded packaging ( molded fan out vs laminate embedded)…
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