Category Archives: Speakers – Tutorial

2016 Tutorial Speakers

Tutorial – Option 1:   ADVANCED IN FAN-OUT WAFER LEVEL PACKAGING Tuesday, December 13 | 9:00am-12:00pm Now that Fan-out wafer level packaging (FO-WLP) has matured, unique advanced FO-WLP structures have been developed. This course will cover these advanced structures of FO-WLP and potential application spaces, technology roadmaps, and benchmarking. The challenges of moving from 300mm FO-WLP…
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