Social Media

Contact Contact Brianne Lamm with questions or for more information at, or 919.293.5600.
Please check back for updates



3D ASIP Updates

TSV Stacked Memory has Finally Arrived!

Register today to attend the 2016 3D ASIP conference to hear industry leaders discussing topics ranging from the status of 2.5/3D and other high density technologies to the transformation of substrate technology in the era of IoT.

The full program will available in Early September!

Program highlights include:

  • Two in-depth tutorials on Tuesday, December 13
  • Speakers from around the world representing 38 organizations and institutions
  • Three keynotes from key industry regions: USA, Europe and Asia

The hotel block is filling up, so be sure to make your hotel reservations soon to take advantage of the discounted rate

Check out our growing list of sponsors and exhibitors. Opportunities are still available, but exhibit space is limited. Don’t be left out!

Agenda Now Available!

The 3D ASIP Agenda is now available!

Registration is Open!

3D ASIP 2016 Registration is Now Open!

Register today to attend the 13th 3D ASIP conference, December 13-15, 2016 at the Marriott San Francisco Airport Hotel, San Francisco, California.

Conference Organizers
Technical Chair: Alan Huffman, RTI

Program Coordinator & Past Chair: Phil Garrou, Microelectronics Consultants of NC

Technical Co-chairs: Mitsumasa Koyanagi, Tohoku University; Mark Scannell, LETI