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Contact Contact Brianne Lamm with questions or for more information at blamm@imaps.org, or 919.293.5600.
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3D ASIP Updates

Program & Registration Now Open!

Register today to attend the 2017 3D ASIP conference to hear industry leaders discussing topics ranging from the status of 2.5/3D and other high density technologies to the transformation of substrate technology in the era of IoT.

The full program Now Available!

Program highlights include:

  • Three in-depth tutorials on Tuesday, December 5
  • Speakers from around the world representing 38 organizations and institutions
  • Five keynotes from key industry regions

The hotel block is filling up, so be sure to make your hotel reservations soon to take advantage of the discounted rate

Check out our growing list of sponsors and exhibitors. Opportunities are still available, but exhibit space is limited. Don’t be left out!


Agenda Now Available!

The 3D ASIP Agenda is now available!


Registration is Open!

3D ASIP 2017 Registration is Now Open!

Register today to attend the 14th 3D ASIP conference, December 5-7, 2017 at the Marriott San Francisco Airport Hotel, San Francisco, California.

Conference Organizers
Conference Chair: Phil Garrou, Microelectronics Consultants of NC

Technical Co-chairs: Mitsumasa Koyanagi, Tohoku University; Mark Scannell, CEA-Leti