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3D ASIP Updates
Program & Registration Now Open!
Register today to attend the 2017 3D ASIP conference to hear industry leaders discussing topics ranging from the status of 2.5/3D and other high density technologies to the transformation of substrate technology in the era of IoT.
Program highlights include:
- Three in-depth tutorials on Tuesday, December 5
- Speakers from around the world representing 38 organizations and institutions
- Five keynotes from key industry regions
The hotel block is filling up, so be sure to make your hotel reservations soon to take advantage of the discounted rate
Check out our growing list of sponsors and exhibitors. Opportunities are still available, but exhibit space is limited. Don’t be left out!
Agenda Now Available!
Registration is Open!
Register today to attend the 14th 3D ASIP conference, December 5-7, 2017 at the Marriott San Francisco Airport Hotel, San Francisco, California.
Conference Chair: Phil Garrou, Microelectronics Consultants of NC
Technical Co-chairs: Mitsumasa Koyanagi, Tohoku University; Mark Scannell, CEA-Leti