Sponsor and exhibitor opportunities are still available, but space is limited and sells out every year.
For more information, download the 3DASIP2017_Sponsorship Form.
Questions? Contact Brian Schieman, firstname.lastname@example.org
7700 South River Parkway
Tempe, AZ 85284
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.
SUSS MicroTec Inc.
220 Klug Circle
Corona, CA 92880-5409
Tel.:+1 951 817 3700
Fax: +1 951 817 0640
With more than 60 years of engineering experience SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nonoimprint Lithography as well as key processes for WLP, MEMS and LED manufacturing.
2031 Concourse Drive
San Jose, CA 95131
Providing flexibility to customers for multiple Wafer/Substrate processes
Founded in 1989, C&D Semiconductor has been serving the global market for nearly three decades. Our products and services cover a wide variety of wafer handling, processing and inspection requirements. C&D designs and manufactures Systems that are used in Semiconductor, MEMS, LED/Opto, solar, telecommunications, compound semiconductor and other related industries.
We endeavor to be a leader in innovation for the semiconductor equipment manufacturing industry. Toward that end we strive to provide our customers with creative solutions to their high-value and lowcost state-of-the-art processing solutions.
C&D SEMI offers a broad set of new applications for the WLP and WLFO customer requirements.
2045 E. Innovation Circle
Tempe, AZ 85284
Amkor Technology is one of the world’s largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is a global strategic manufacturing partner to leading semiconductor companies and electronics OEMs.. Amkor’s operational base encompasses more than 8M ft2 of volume production, development, sales and support services in Asia, Europe and the United States. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator. For more information, visit www.amkor.com.
SHENMAO America, Inc.
2156 Ringwood Ave.
San Jose, CA 95131
Tel.:+1 408 943 1755
SHENMAO Technology, Inc. as the World’s Major Solder Materials Provider produces Semiconductor BGA and Micro BGA Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux, Dipping Solder Paste, LED Die Bonding Solder Paste, SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms and PV Ribbon provided to OSAT’s, EMS and OEM companies worldwide. Founded in 1973, SHENMAO Technology, Inc. superior products are distributed from 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc., the American subsidiary of SHENMAO Technology, Inc. of Taiwan, manufactures solder paste in San Jose, CA, USA. For more information visit www.shenmao.com.