Program & Registration Now Open!

Register today to attend the 2017 3D ASIP conference to hear industry leaders discussing topics ranging from the status of 2.5/3D and other high density technologies to the transformation of substrate technology in the era of IoT.

The full program Now Available!

Program highlights include:

  • Three in-depth tutorials on Tuesday, December 5
  • Speakers from around the world representing 38 organizations and institutions
  • Five keynotes from key industry regions

The hotel block is filling up, so be sure to make your hotel reservations soon to take advantage of the discounted rate

Check out our growing list of sponsors and exhibitors. Opportunities are still available, but exhibit space is limited. Don’t be left out!

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